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Multilayers are used for most complex electronic equipment and consist of three or more layers of separate and usually different wiring patterns, insulated from each other and interconnected by thru hole plating.
Ginplate MB 438
Ginplate MB - 438 system produces oxide coatings on copper. Compatible with all commonly used dielectric substrates. Ginplate MB - 438 produces self limiting oxide coating thickness and improves multilayer board reliability.
Ginplate MLB 495
Ginplate MLB - 495 is the first step in the ginplate etch back/desmear process, without chromic or sulfuric acid or plasma. Ginplate MLB - 495 is a unique dielectric sensitizer. It predisposes the dielectric to exhibit a clean, micro roughned, micro-porous surface at the end of etchback / desmear process.
Ginplate MLB 497
Ginplate MLB - 497 is the second step of a three step of desmear/etch back process. It is permanganate based system consisting of highly alkaline promoter with primary and secondary oxidiser. It is regenerable and thus eliminates sludge formation
Ginplate MLB 498
Ginplate MLB - 498 is a high performance neutralizer for use in the desmear/etchback process of MLB. The process enhances the adhesion of electroless copper deposit to dielectric. The Ginplate MLB - 498 additive is added to accomplish neutralization and glass etch in single step.